Comments on: Solder Reflow with a Frying Pan – part 2

By: qyKristin

qyKristin — Thu, 18 Feb 2010 13:23:26 +0000

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By: Frying Up a PCB - Spooning

Frying Up a PCB - Spooning — Mon, 09 Mar 2009 21:46:51 +0000

[...] [Part 1] [Part 2] [...]

By: Nate

Nate — Mon, 09 Mar 2009 17:12:51 +0000

Nice article. You can get more accurate measurements using a thermocouple. Also, you might want to experiment with different heating profiles. To avoid solder bridges, use a thinner layer of the paste. As you found, the surface tension as it melts helps it stay on the pads/pins, so going with a thinner layer allows the solder blobs to pull back from each other.

By: adam

adam — Sat, 28 Jun 2008 10:55:01 +0000

Nope, I don’t think it got hot enough to do that. The back of the board looks fine.

By: Paul

Paul — Sat, 28 Jun 2008 00:54:27 +0000

does the back of the board burn or discolor from the long cool down time?

By: adam

adam — Thu, 05 Jun 2008 11:09:15 +0000

Its sort of a universal communication processor I designed a ways back. It can talk RS232, USB and IRDA. Depending how you program the ARM chip, it could be an RS232 comms analyzer, baud rate converter, protocol converter, IRDA-to-USB adapter and probably a few more things too.

By: fed

fed — Thu, 05 Jun 2008 09:07:25 +0000

out of curiosity, what are you making there?